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AMTECH ORIGINAL NC-559 ASM 10ML

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  • Excellent capacity of solder-stickiness
  • Excellent Anti-wet Capacity
  • Widely used on BGA, PGA, CSP packages and flip chip operation
  • Suitable for multiple reflow
  • No-clean and Lead free for environmental protection.
  • It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing

Shipping Cost : Rs 0.00

LKR 950.00

Description

AMTECH ORIGINAL NC-559 ASM 10ML

  • Excellent capacity of solder-stickiness
  • Excellent Anti-wet Capacity
  • Widely used on BGA, PGA, CSP packages and flip chip operation
  • Suitable for multiple reflow
  • No-clean and Lead free for environmental protection.
  • It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing

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    1. Rated 4 out of 5

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      Wow great product